GE Global Research, an industrial research lab of General Electric Co., and TOKKI Corp., a supplier of organic light emitting diode (OLED) manufacturing equipment, announced Friday a joint agreement to develop PECVD Film Encapsulation technology and equipment for manufacturing organic electronics such as OLED flat panel displays.
The project will focus on developing and demonstrating pilot line manufacturing equipment that successfully incorporates Global Research’s film encapsulation technology, with the the ultimate goal of producing glass-based OLED displays, for commercial sale, that are thinner in design and lower in cost.
As part of the agreement, GE Global Research will license its patented PECVD film encapsulation process to TOKKI for use in the company’s state-of-art OLED manufacturing equipment.
OLED devices require a high degree of hermetic sealing or "encapsulation," since moisture and oxygen can impede the devices’ functionality. The encapsulation technology is seen as a critical component for enabling future OLED devices and process technology that are much thinner in design, while still protected from environmental degradation.
GE Global Research, headquartered in Niskayuna, N.Y., has facilities in India, China and Munich.
TOKKI Corp., headquartered in Tokyo, Japan, is a distributor of machinery and other value-added specialty machines.