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Thermally Conductive Epoxy

Formulated for electrical potting and encapsulation applications, Company's EP36AO epoxy combines high thermal conductivity with thermal stability.

Formulated for electrical potting and encapsulation applications, Company's EP36AO combines high thermal conductivity with thermal stability. This flexible, heat-resistant epoxy has superior mechanical properties. Serviceable over the temperature range of -80°F to +500°F, the product provides high performance in harsh conditions. Once cured, it features solid electrical characteristics including a dielectric strength of 400 vols/mil, a volume resistivity of 2-3 x 1012 ohm-cm and thermal conductivity of 9-10 BTU·in/ft2·hr·°F at 25°C. This system has a coefficient of thermal expansion exceeding 75 in/in x 10-6/°C at 60°C and a tensile strength of over 2,000 psi. The product is a capable adhesive and coating that adheres well to both metallic and non-metallic substrates, and it features long-term chemical resistance to an array of organic and inorganic chemicals.


Master Bond, www.masterbond.com

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