FCI recently boosted its power solution offerings with the introduction of the High Power Card Edge (HPCE) Board-to-board (BTB) connectors, which provides more options for customers looking for high current density board-to-board connectivity. Specifically designed for applications requiring a high current density and low power loss, this two-piece solution delivers up to 200Amps/linear inch, a low contact resistance of just 0.6mΩ per contact, within a compact design of just 7.5mm in height. The power contacts and housings are made for AC and DC power distribution applications and are ideal for next generation 1U/2U servers, switches, storage enclosures, telecommunications equipment, industrial PCs, controls and instrumentation equipment. The connectors are produced in a wide variety of configurations to serve a variety of applications and the integrated guide features enable ‘blind-mating’ which facilitates easy connectivity and precise alignment. The connector also features a highly ventilated housing design which enhances heat dissipation. This is a crucial feature in server and data storage applications, as it helps avert overheating issues, and increases the reliability of the end equipment.