PACK EXPO: Rockwell Automation Showcasing Cutting-Edge Tech

Rockwell Automation is sponsoring the Center for Trends and Technology (CTT), which will be at booth #1358 in the central hall. The classroom sessions, which focus on topics such as line integration, cloud computing and mobility on the plant floor, will feature speakers and displays from leading technology companies.

Rockwell Automation (Milwaukee, Wis.) is sponsoring the Center for Trends and Technology (CTT), which will be at booth #1358 in the central hall. The classroom sessions, which focus on topics such as line integration, cloud computing and mobility on the plant floor, will feature speakers and displays from leading technology companies, including Cisco, Endress+Hauser, Jacobs Automation, Microsoft, Motorola, Panduit, ProSoft Technology Group and Spectrum Control.

During each day of the event, manufacturers in food, beverage, life sciences, pharmaceuticals, and household and personal care can attend five one-hour classroom sessions aimed at helping them achieve higher productivity, efficiency and sustainability. Topics covered will include network security, manufacturing convergence, safety, packaging-line integration, energy management, remote asset management, mobility, cloud computing and robotics integration.

Mike Wagner, manager, Global Packaging Business at Rockwell Automation said in a statement: “Our goal with the educational sessions and displays in the CTT is to arm manufacturers with an understanding of new and emerging technologies, and demonstrate how to use them to solve unique production challenges. In addition, the CTT will spark collaboration among manufacturers, OEMs and technology leaders alike, keeping them at the forefront of their industry.”

Learn more about PACK EXPO at www.packexpo.com.

More in Industry 4.0