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ODB++: THE MOST EFFECTIVE
COMMUNICATIONS FORMAT FOR
TRANSFERRING PCB DESIGN DATA TO
MANUFACTURING
MAX CLARK, MENTOR GRAPHICS
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Competing in global markets requires OEMs and suppliers to continuously seek ways to more effectively
communicate manufacturing requirements when bringing products to market. The collection of manufacturing
requirements can be referred to as the product model. For the suppliers, the product model defines ‘what’ needs
to be manufactured, but does not define ‘how’ the manufacturing process will be accomplished. When complete,
the product model contains the manufacturing content necessary to convey the fabrication, assembly and test
requirements to suppliers. The method used to communicate the product model is a key factor in determining
process efficiencies, the level of product quality and ultimately the rate a product moves to volume production,
which determines the actual time-to-market. When an effective product model is used to streamline the
manufacturing process, many segments of the design and manufacturing operations can contribute to the
successful launch of a new product.
But today there are fundamental inefficiencies used in communicating product models into manufacturing that
lead to unnecessary delays and additional risks that could largely be avoided if improved communication practices
were implemented. One fabrication house estimates that upwards of 25% of all data packages received today
have some form of a data integrity issue.
Adopting a common and comprehensive product model between design and manufacturing will allow both the
OEMs and suppliers to more effectively:
■ Meet product requirements while reducing costs
■ Minimize production delays
■ Optimize manufacturing productivity through improved knowledge exchange including proper IP
management
There have been industry driven initiatives to improve upon the data exchange formats available. The most widely
adopted improvement was based upon enhancing a format originating in the 1960s with the creation of Gerber
RS274X. But before you can begin to consider the data exchange format of choice, you should determine what the
data requirements to support the manufacturing processes are.
COMMUNICATING TODAY’S PRODUCT MODEL
The primary method of communicating a product model into manufacturing today is based on a series of
independent files, in several different formats, each defining a segment of the manufacturing requirements. The
most common bare PCB formats are Gerber to represent physical board layers, Excellon to represent the
mechanical interconnect information and an IPC 356 file to represent the electrical intent. For each product model,
there will most certainly be multiple Gerber files, possibly multiple Excellon files and hopefully a single IPC 356 file.
To effectively convey the assembly requirements, a non-standard column based list is typically provided containing
the OEM’s internal part numbers, x and y locations, rotations, side, etc. A bill of material (BOM), at times along with
an Approved Vendor List (AVL), is also provided to connect the OEM’s internal component part number to a
component supplier and supplier part number. There may be additional files in yet different formats containing,
fabrication and assembly documentation, loaded board test access locations and other product related content.
The challenge in using this method of introducing a product model into manufacturing is that the reconstruction
of the design requires reverse engineering efforts to recreate the product model’s manufacturing intent. Most
CAM software solutions, in order to ensure manufacturing guidelines are met, require some form of board
construction information or buildup. In the case of Gerber data, the layer representations have to be organized into
design buildup positions and purposes, the Excellon drill information has to define the hole finish types and depth
through the buildup, component locations need to be aligned to outer copper layers, etc. Each of these steps is
error prone and quite often incomplete or inconsistent manufacturing data results. For example, drill count
information does not match the drill drawing, electrical content is inconsistent with the software extracted netlist,
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component rotations are not
consistent with component
land patterns, test point
locations do not align with
copper outer layer pads, etc.
BARE PCB CONSTRUCTION
Many of the product model
files just mentioned were
created to convey mechanical
instructions to production
equipment. This is especially
true in the case of bare PCB
manufacturing. All forms of
Gerber are used to convey
how the multiple phototools
used in the imaging process
should be created by
mechanical or laser based
photoplotters. The Excellon
format is used to instruct
mechanical drill and routing
equipment how to respond
when creating holes or
removing boards from a
fabrication panel.
No matter which format is used, one common
characteristic is that the representation of the product
model has to be based on the simplest and most primitive
elements defined by the format, regardless of how that
might compromise the clarity of the content. While this
might have not been an issue when used for the intended
purpose, the advent of more sophisticated CAM systems
found these primitive data formats challenging.
The representation of board design layers that should have
been a simple collection of objects, ended up as a
collection of overly complex objects that enlarged the
amount of data. Also, basic design intent, such as finish
types for drilled holes, was also not an integral part of any
format. This information ended up embedded in drill
tables and drawings for manufacturing consumption.
Later, CAM systems found it necessary to reverse the effect
of the over simplification through the use of software.
These actions, at the time necessary and with good
intention, add unnecessary risk and require additional
engineering resources.
Figure 1: Typical
listing of all files that
need to be commu–
nicated to the PCB
manufacturer when
using traditional
Gerber files.
Figure 2: This image of filled-in surface area is based on
Gerber RS274D data files.
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PCB ASSEMBLY PROCESS
The basic product model information required to complete the assembly process is the x/y locations, rotations, and
the possible component part numbers for each of the component placements. The variety of manufacturing
equipment providers and machine capabilities are so variable that no single format was deemed sufficient to cover
all possibilities. As a result no “quasi-standard” format was selected to represent even the basis of a product model.
In addition, the solder paste land patterns that are used to create the solder stencil, which then is used in the
application of the solder paste, must be present in the product model.
Since no standard was established, today’s solutions are typically based on multiple non-standard formatted files
that are either in text or Microsoft Excel formats. Much like the CAM systems used in bare PCB manufacturing, the
assembly CAM systems are then required to implement solutions to read these non-standard formats in an attempt
to reconstruct the assembly representation of the product model.
COMPONENT ORIENTATION
These are processing challenges that increase risk and therefore require additional resources during this reverse
engineering process. Component rotation (orientation) is based on the EDA system’s representation, which is not
necessarily consistent with the component orientation as present in the assembly CAM system. Therefore, through
the use of a CAM system, resources are assigned to complete the product model as a final assembly by once again
processing the bare PCB’s Gerber-based outer layer information. Typically, this would include the outer copper and
silkscreen layer information. Using the outer layer copper, silkscreen, and component location/rotation information,
the CAM system attempts to recreate the assembly representation.
Assigning component rotations begins with aligning the placement coordinates with the outer layer land patterns
and then managing the component rotation through the use of polarity indicators. Polarity indicators are usually
found on the silkscreen and are used to define the orientation of the component as found in the placement file.
There can be a number of errors starting with simply misinterpreting the intended rotation assignment or an
inconsistency in the component rotations as defined in the original data source.
In addition to processing the
outer copper layers, as described
earlier, if the design solder paste
definition was included using the
traditional Gerber method, the
assembly CAM system could also
process this content. The solder
paste would then be aligned
using the same methods as the
outer copper and silkscreen
layers, along with the
components.
Next, using reverse engineering
methods, the solder paste
openings are reconnected to
copper landings and, ideally, back
to a component to recreate a
land pattern representation.
Finally, using the land pattern
representations, the assembly
manufacturer’s optimal solder
paste stencil can be designed.
Figure 3: Image of a board outer layer, associated silkscreen and a component centroid
indicator, along with a text file indicating the component rotation. Should something
convey the message “what is 0, 90, 270, 360, etc. degrees?”
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This reverse engineering process is again
time-consuming while adding no actual
value to the final assembly. There are also
risks that an error within the land pattern
assignment could lead to an incorrect
solder stencil design resulting in quality
related issues identified at the very end of
the manufacturing process.
FINAL TEST
Access to critical pad locations on an
assembled finished product is an essential
part of final test. The test equipment
requires the placement of test pins such
that proper contact with a copper pad is
possible. Inadequate test coverage or
insufficient test access will compromise
quality testing during final production.
In many cases designers go to great
lengths to ensure their board designs have
allowances for proper testing. However,
there are no standard methods today for conveying this vital information. In some cases the test locations can be
determined by a unique pad size on the outer layer. In other cases reference designators with a unique prefix are
provided. Even a text file with x/y and
side locations have also been created
and then sent to manufacturing. In all
the cases above, CAM systems will
attempt to take the outer layer
information and reverse engineer in
the initial test location as planned by
the designer. In the event the testing
is found to be inadequate, the CAM
system will attempt to improve
coverage working with the product
model’s outer layers.
The task of creating an acceptable test
strategy through this type of process is
user intensive. Many process steps
introduce unnecessary risks along the
way. All of which can lead to test
procedures not as complete as
possible or test implementation
challenges that go undetected until
well within production.
Figure 4: Here, the solder paste opening can be seen with a component land
pattern extracted for the base Gerber data.
Figure 5: This image shows the test locations by determined pad sizes.
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EFFECTIVE PRODUCT MODEL
COMMUNICATION
Addressing the need for effective
design to manufacturing
communication begins with the
product model that contains the basic
buildup information and other related
manufacturing content is then
associated with it. The buildup
representation acts as the central
repository for what was once multiple
files, eliminating the potential errors of
assigning layer types (signal, power/
ground, solder mask, etc.) and layer
positions as the basis of the product
model. Mechanical and assembly data
elements are represented right along
with the board copper layer data
elements. The buildup information can
be used to maintain the interdependencies between other data elements, empowering other CAM systems to
harness those relationships in order to improve production efficiencies.
The product model then represents the graphical content
in a comprehensive fashion that is completely
independent of historical restrictions. For example,
surface pad locations that were once drawn with multiple
data elements would be represented as a single element
with a land pattern definition. Solid areas previously filled
in with multiple drawn features would be represented by
complex, yet simpler to manage, surface polygons.
Representing the data in this fashion would improve on
the communication of complex manufacturing
requirements while enabling manufacturing facing CAM
systems to efficiently manage production requirements.
With the basic product model organized and
represented in an intelligent manner, the product model should begin to expand to also eliminate manual
assignments of important manufacturing requirements. As an example, the final finish and tolerances of each drill
hole requires further definition. Therefore the final finish
method of plated, non-plated, via, tolerances, etc. and
tolerance information assigned to each drill size should
be an essential part of the product model. Having this
information as part of the product model reduces the
risk of manufacturing errors by minimizing the
occurrences of incorrectly sized and improperly
processed holes. Both of these errors will typically result
in costly scrap and a delay in product delivery.
Thus far the entire product model definition has
included the requirements in order to construct a bare
Figure 7: On the left is an image of drawn SMD pads and filled
in areas, with the same representation in ODB++ on the right.
Figure 8: Here is the traditional drill table on the left, and the
same information with the drill tools manager.
Figure 6: The
filenames can be
represented in
matrix form, where
the matrix clearly
illustrates layer
types, polarity, drill
depth, and other
necessary
fabrication
information.
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PCB prior to assembly. A comprehensive product model should contain the final component placements,
rotations and component geometries. In addition, within the product model the possible component
manufacturers and part numbers required for component
ordering and assembly should be assigned. This
information enables the procurement of required
components and the creation of the manufacturing process
definition (MPD), which later drives the entire product
assembly process. Having the component package types,
lead forms, physical sizes and weights enables the
automated process of creating pick and place programs for
an assembly line and facilitates the creation of manual
assembly procedures.
Having a correct representation of the product model in
order to create assembly machine programs is important,
but of nearly equal importance is an optimal solder stencil.
Solder stencils are a critical part of the manufacturing
definition because they control the amount and shape of
the solder paste applied to each surface mount location. A
well-defined product model would maintain the
connections between the copper landings to each lead
of the component package. In addition the type of lead,
gull wing, J- lead, ball, etc., would also be assigned to
each of the component leads. Later, the combination of
component package, lead form and copper landing
together would be used to define the shape and size of
solder stencil opening to create in order to apply the
appropriate amount of solder paste.
One of the very final production process steps required
is test. The product model should carry the designer’s
intended test locations. The test locations are defined
by a relationship assigned to select copper pads. The
lack of a solder mask opening for the defined pad would
indicate a test pin with the ability to penetrate the solder
Figure 9: Here we compare the
component placement list with the
ODB++ component layer display.
Figure 10: This complex solder stencil design includes a VPL
package with lead contact area. Solder design should
include the use of home plates and possible a dog bone.
Figure 11: This figure shows the test location by ODB++ feature
attribute and the test point potentials.
ODB++: The Most Effective Communications Format for Transferring PCB Design Data to Manufacturing
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MF 2-12 MISC1490-w
mask is required or the location is not suitable. With a complete product model, the CAM system would be
capable of automatically increasing test coverage while considering the designer’s intent, thereby ensuring the
highest quality test possible.
HOW EFFECTIVE IS YOUR PRODUCT-MODEL EXCHANGE RELEASE
TO YOUR SUPPLY CHAIN?
In an ever increasing competitive landscape, the design/supply chain, as defined by the PCB manufacturing
process, should constantly look to reap the benefits of their existing investments. This is not just true in the sense
of technology, but also design/manufacturing expertise, lessons learned from past experiences, valued partner
relationships and implementing already available best practices. When the supply chain has optimized the data
exchange of design information into the various manufacturing areas, each area will be able to optimize their
individual manufacturing processes by obtaining the maximum benefits on their individual investments, thereby
further streamlining efficiencies into the process and in turn delivering a quality product at an optimal price.
Existing today is an alternative to the lower-level task driven formats such as Gerber and Excellon. The ODB++
format has the ability to transfer all, or user-selected portions, of the PCB product-level intelligence required to
support the PCB manufacturing processes (fabrication, assembly, test). Therefore, the ODB++ format enables
design-to-manufacturing integration within the fabrication, assembly and test processes, while still protecting the
design’s intellectual property (IP). In doing so, the ODB++ format eliminates the daunting and risky tasks required
to reconstruct the product-model from multiple legacy formats and the processing of additional information
received in non-standard formats. These same product-model reconstruction tasks are often repeated multiple
times within the PCB manufacturing supply chain.
The infrastructure currently within the ODB++ format is based on expert knowledge gained over years of industry
use and in many ways captures the best practice requirements in defining the multitude of PCB manufacturing
processes. The ODB++ format harnesses all the data requirements for the design-to-manufacturing exchange of a
product model that meets, and in many ways exceeds, the need for an effective and efficient data-exchange
process between OEMs and their suppliers. Using the ODB++ format, within the PCB manufacturing supply chain,
enables all parties to invest more in improving key business and manufacturing processes that are critical to their
success.