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Hot Melt Adhesive Supply Unit

The improved next generation Dynamelt S adhesive supply unit has been designed for packaging applications. The unit features the Melt-on-Demand System and comes in a compact and flexible footprint for integration into OEM equipment and existing lines.

The improved next generation Dynamelt S adhesive supply unit has been designed for packaging applications. The unit features the Melt-on-Demand System and comes in a compact and flexible footprint for integration into OEM equipment and existing lines. The unit consumes 20% less energy on average than similar competitive units. An advanced piston pump design permits low-air pressure operation, resulting in a significant reduction in overall air consumption. The primary filter boasts 15 times more surface area to provide easier and safer filter changes (filter comes out with the filter nut), thus reducing downtime. The larger filtration surface lasts longer, requiring less frequent changes and maintenance. The temperature sensors are easily accessible on the rear manifold of the machine, contributing to reduced maintenance.


ITW Dynatec, www.itwdynatec.com

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