The Tactilus® dynamic electronic pressure-mapping system allows measurement of contact pressures between two mating surfaces. The product reveals critical pressure distribution problems that can compromise package integrity. Pressure readings are captured as the sealing surfaces make contact. The software analyzes the data from the sensors within a pad, enabling the engineer to view the data on a computer screen and make adjustments to the heat sealing equipment. The product comes equipped with sensor element, electronics con troller and Windows-based software.