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Laser Ablation Stepper

PACKAGING EQUIPMENT: SUSS MicroTec introduces its latest generation laser ablation stepper. This ELP300 Excimer laser platform is designed for high volume manufacturing and processing of wafer sizes between 200 and 300mm.

SUSS MicroTec introduces its latest generation laser ablation stepper. This ELP300 Excimer laser platform is designed for high volume manufacturing and processing of wafer sizes between 200 and 300mm.

  • Employing Excimer laser technology to directly create microstructures in lieu of traditional photolithography and wet etch approaches
  • Address the challenges in manufacturing next generation semiconductor packages
  • Address a means to lower manufacturing costs
  • Environment friendly
  • Eliminates the need for wet etching process steps utilizing toxic materials

www.suss.com

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