Daisy Data Displays, Inc. (D3) launched the use of COM-Express modules in the Rigmate all weather rugged PC product line with the objective to expand its use throughout all PC designs. D3 switched processor boards over to COM-Express technology, which allows the modules to plug into custom made, application-specific carrier boards. Although the modules measure just 95 mm x 125 mm, they include a variety of generic functions such as video, audio, Ethernet, storage interfaces and USB ports. The COM-Express modules are a perfect complement to D3’s industrial units as they provide functions essential for every PC, still having the ability to pair it with a custom designed carrier board for more specific functions. D3’s custom carrier boards provide the flexibility of selecting different central processing unit (CPU) based customer applications while keeping the same form factor. Therefore, as new processors are introduced, the customer will be able to upgrade the unit from low-power single core ATOM Intel all the way to multi-core i7 processors with ease.
INTERPHEX Booth 3705, www.d3inc.net
