2008 Sealing Technology Seminars

Seminars For Engineers, a division of Sensor Products Inc., announces in association with D3 Consulting the 2008 dates for its Sealing Technology for Packaging Processes seminar. Focusing on the various methods for applying heat to flexible and semi-rigid packaging in order to achieve quality seals, Sealing Technology for Packaging Processes covers various sealing technologies, seal testing procedures, adhesive sealing, polymer film and foil characteristics, and process/package validation.

Seminars For Engineers, a division of Sensor Products Inc., announces in association with D3 Consulting the 2008 dates for its Sealing Technology for Packaging Processes seminar. Focusing on the various methods for applying heat to flexible and semi-rigid packaging in order to achieve quality seals, Sealing Technology for Packaging Processes covers various sealing technologies, seal testing procedures, adhesive sealing, polymer film and foil characteristics, and process/package validation.

  • March 4-5, 2008 Philadelphia, PA
  • August 5-6 2008 Cleveland, OH
  • November 18-19, 2008 Philadelphia, PA


  • Any personnel in the R&D, testing, process, design, fabrication and manufacturing of food, pharmaceutical, medical, cosmetic, chemical, veterinary or industrial product packaging can benefit from this unique course. Packaging, film and foil personnel will also benefit. Information about this and technical seminars in other locations is available at www.SeminarsForEngineers.com/packaging, by emailing info@SeminarsForEngineers.com, or by calling (877) 755-2272
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