Agilent Technologies Inc. announced Tuesday a breakthrough for in-line 3D X-ray inspection systems that can detect printed circuit board assembly (PCBA) solder and manufacturing assembly defects.
The new system reduces manufacturing conversion costs without losing defect-detection capability, by approximately doubling the throughput of 3D solutions while using full 3D capability to find defects. It directly reduces the number of systems required to meet manufacturing volumes by cutting in half the required capital expenditures. Secondly, it enables complete 3D inspection of the entire PCBA at in-line speeds for the highest defect detection possible.
Previously, high-throughput 2D solutions have been used in limited applications where the PCBAs under test are predominately single-sided.
Agilent Technologies Inc. specializes in measurement and technology in communications, electronics, life sciences and chemical analysis.