SST and TSMC Expand SuperFlash Agreement

Silicon Storage Technology Inc. (SST) and Taiwan Semiconductor Manufacturing Co. (TSMC) have expanded their agreement to provide TSMC customers with advanced deep sub-micron embedded Flash technology. The agreement covers TSMC's 130-nanometer embedded Flash memory processes based on SST's SuperFlash technology. The two companies signed the original agreement in 1997.

The technology is used in CMOS logic processing in manufacturing. In addition, SST has formed relationships with semiconductor manufacturers and global foundry partners, enabling SuperFlash technology to be widely accessible to the industry.

"The latest agreement assures our customers that they will be able to stay on the leading edge of embedded memory technology," Rick Tsai, president and CEO of TSMC said in a prepared statement.